Teledyne DALSA's vanadium oxide (VOx) based microbolometer long-wave infrared detectors cover wavelengths from 8-14 µm and provide performance consistent with the best in the industry--they power our own Calibir IR cameras. Our novel wafer-level packaging (WLP) approach to microbolometer manufacturing in an optimized MEMS infrastructure gives us the ability to dramatically alter the traditional price-performance tradeoff.
Our advanced capabilities in wafer processing allows us to bond multiple 200 mm wafers precisely in a 3D stack that eliminates the need for external chip packaging--packaging which can account for 75% or more of device cost.
By stacking a cap wafer, using world-leading vacuum sealing technology, onto a CMOS high-speed readout circuit (ROIC) wafer populated with VOx pixels, we deliver smaller, lighter devices with leading edge performance and game-changing lower costs, enabling compact detectors with advanced integrated features that will drive the next phase in the evolution of uncooled IR imaging.
If your vision for uncooled IR applications has been limited by the size and cost of traditional packaging, talk to Teledyne DALSA about our WLP microbolometer solutions.
