Teledyne Imaging has a broad range of specialist anti-reflective coatings, package surface treatments and window spectral filter design and process capabilities.
Teledyne Imaging has a broad range of specialist on die anti-reflective coatings, package surface treatment and window spectral filter design and process capabilities including up to 8” silicon wafer backthinning and die, package and optical window coatings and filters.
Backthinning of a CCD image sensor is a very well established process for achieving high quantum efficiency and the majority of high-specification space and science applications have used such backthinned devices for many years.
CMOS sensors offer advantages over CCDs for a number of these applications and it is possible to back-thin CMOS devices and obtain the same performance as the CCD, which has been demonstrated by Teledyne Imaging’s - Teledyne e2v image sensor company.
The technology of thinning and back-illumination, that by avoiding losses in the electrode structure, enables a high quantum efficiency to achieved right across the useful spectral range of silicon based image detectors for X-ray to near infrared wavelengths.
Backthinned and back-illuminated devices are now the primary choice for high-specification space and science applications.
Teledyne Imaging is able to process 6” and 8” silicon wafers and offers backthinning services to industry. Please contact us for more information.
Teledyne Imaging has a broad range of specialist on die anti-reflective coatings, package surface treatment and window spectral filter design capabilities and process capabilities.
Anti-reflective and multilayer anti-reflective coatings enable detector solutions to be tailored to the application wavelengths to optimise and increase the quantum efficiency of the device.
Multi-channel spectral optical windows allow specific wavelengths to be channelled onto specific areas of the detector to receive specific wavelengths of light.
For package that may need anti-corrosive treatment, specialist treatmenst including nickel can be applied during fabrication of the device.
The combination of decades of experience, in-house processes and working with specialist partners enables the most sensitive devices to be developed for any application whether it is a UV detector or a spectroscopic instrument.
The MTG VISible Detector Assembly (VisDA) for EUMETSATs MTG-I satellite is an example of cutting edge design and amalgamation of different coating and window filters to produce a highly sensitive CMOS image sensor for a Earth observation space application.
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