With the continuing trend of the global sector of new aerospace companies and ventures working independently of national space agencies to develop faster and cheaper access to space and spaceflight technologies and lowering the barriers to entry to space industry, there is a need for alternative approaches to providing imaging and sensor systems capabilities in space.
Teledyne Imaging is at the forefront of this technology development and uniquely positioned to use more than 200 years of combined experience in producing high reliability devices for operation in Space.
While national space agency, government, defense and high resolution and data collection programs will continue to demand the most advanced and highest space qualified program and product assurance, there are other needs that do not demand the same level of space qualification and product assurance.
Teledyne Imaging is able to tailor its approach to space qualified imaging sensors and systems by calling upon the appropriate levels of expertise from what we refer to as the “Teledyne Imaging Lab”, providing the levels of characterization, testing, radiation hardened design and product assurance processes that are needed and appropriate for the new space requirement.
Teledyne Imaging is able to identify existing standard devices suitable for up screening for new space applications. Always looking to the future, Teledyne has also embarked on a program of product platform development of new standard devices to support the emerging trends in land scanning and Earth data collection.
Teledyne can do this because the group is underpinned with decades of experience and data to call upon to inform these decisions. This is the Teledyne approach to COTS+.
Resolution: 16000 × 4 Pixel size: 5 µm Very high resolution CMOS time delay integration (TDI) image sensors with CCD on CMOS architecture designed for space satellite Earth observation (EO) applications.
Resolution: 2048 × 2048 Pixel size: 10 µm Highly flexible CMOS image sensor platform designed for a large range of space applications.
Resolution: 1280 × 1024 Pixel size: 5.3 µm 1.3 Mpixels B&W and Color CMOS Image Sensor
Resolution: 1280 × 1024 Pixel size: 5.3 µm 1.3 Mpixels B&W and Color CMOS Image Sensor
Resolution: 244 × 488 Pixel size: 70 µm space qualified CMOS image sensors, with unparalleled performance in terms of sensitivity, radiation tolerance and low power consumption.
Resolution: 1024 × 1024 Pixel size: 13 µm Back illumination technology and extremely low noise amplifiers
Resolution: 720 × 1152 Pixel size: 22.5 µm Full-frame imaging device with two image area sections that can be clocked separately
Resolution: 1024 × 1024 Pixel size: 13 µm Extreme performance in high frame rate ultra-low light applications
Resolution: 1024 × 1024 Pixel size: 10 µm Extreme performance in high frame rate ultra-low light applications
