New Technology Showcase 2020


6 Industrial Imaging Technology Sessions,
1 Must-Attend Virtual Event

While Covid-19 has forced the cancellation of tradeshows and conferences around the world, our product development team hasn’t slowed at all. Over the last six months, we’ve introduced dozens of new imaging components, driving significant advances in key industrial vision segments; including machine learning and AI; extreme high-resolution and high-speed imaging; 3D sensing; multi-spectral imaging; and high-volume, low-cost CMOS sensors. Please join us for this multi-session, virtual event to learn about the newest and most innovative imaging solutions from Teledyne.

Sign up for one or all six technology sessions


Tuesday, November 17, 2020 - 9:00 AM (ET) 

Clarity at High Speed – Performance Imaging

Discover how our newest area and line scan technology can improve defect detection, reduce lighting and lens costs, and help reduce takt time. Learn how to capture several images at once from independent light sources with multi-array technology, and the newest advances in frame grabber technology with multi-camera inputs. High performance, cost-effective solutions for today’s most demanding imaging challenges.



Xing-Fei He - Senior Product Manager, Teledyne DALSA

Xing-Fei He is Senior Product Manager at Teledyne DALSA for the industry leader’s linescan and TDI product lines. Prior, he served as Product Line Manager at JDS Uniphase, and Business Development Manager at Luxell Technologies. He holds a B.Sc. and M.Sc. Degree in semiconductor devices from Zhongshan University and a Ph.D. in laser physics from Australian National University. His areas of expertise include imaging, displays and photonics.

Meet Mark

Mark Butler - Business Analyst, Teledyne DALSA

Mark Butler is a Business Analyst at Teledyne DALSA and has been in the Machine Vision Industry for 25 years. For the majority of the past 10 years he has managed the Product Management Group which delivers products based on the needs of our customers. Prior to this he product managed our Piranha and Spyder camera lines, and even designed some of our earliest TDI cameras. He holds a Master’s Degree in Business Administration and a Bachelor’s Degree in Electrical Engineering.

Tuesday, November 17, 2020 - 10:30 AM (ET) 

Connection is Everything – Camera/Data Interfaces

This session will highlight the pros and cons of multiple data interfaces including GigE Vision (1GigE, 5GigE), USB3 Vision, CoaXPress (CXP), Camera Link, and Camera Link HS, with examples from our comprehensive portfolio of area scan cameras. See our newest products leveraging the newest interfaces such as Teledyne e2v MIPI optical modules, Lt Series USB3 board level cameras, and Genie Nano cameras in 5GigE and CXP-12 versions including frame grabbers.


Meet Manny
Manny Romero - Senior Product Manager, Teledyne DALSA and Teledyne Lumenera

Manny Romero is Senior Product Manager at Teledyne DALSA and Teledyne Lumenera for Machine Vision 2D cameras. With 23 years of machine vision industry experience in roles from R&D to strategic product development, Manny brings deep expertise in image acquisition systems, communication protocols and camera platform design.

Eric Carey - Vice President of R&D, Teledyne DALSA

Eric Carey is the Vice President of R&D and Operations at Teledyne Imaging Montreal. In this position, he is responsible for the overall direction and running of the research and development department and the manufacturing department. He supervises development of frame grabbers, 2D cameras, 3D laser profilers, infrared cameras, and AI products. He holds over 22 years of experience in the imaging industry. Eric has been the Chairman of the Automated Imaging Association’s GigE Vision Committee from 2005 to 2017. He has a Bachelor degree in electrical engineering and a Master degree in applied sciences, both from Polytechnique Montréal. He holds an MBA from the University of Sherbrooke.


Wednesday, November 18, 2020 - 9:00 AM (ET) 

AI & Embedded Vision – Driving System Innovation

Learn about the benefits of AI over traditional image processing and how it can solve challenging problems. The latest Sapera™ Vision Software suite includes Sapera Processing and the new Astrocyte™ graphical application for training neural networks. Learn how users can bring in their own image samples and train neural networks to perform classification, object detection, segmentation and noise reduction in their own applications. Learn about advances in embedded vision along with the newest AI capabilities.


Meet Bruno

Bruno Menard - Software Director, Teledyne DALSA

Bruno Menard is Software Director at Teledyne DALSA. With over 25 years in Machine Vision software, Bruno has experience in image processing and analysis such as barcode reading, pattern matching, OCR, 2D/3D measurement, color analysis, and artificial intelligence. He has managed a wide range of projects including image processing deployment on various embedded platforms and processors. For the last 3-4 years his focus has been dedicated to innovation in 3D image analysis and artificial intelligence. Bruno holds a Master Degree in Engineering from Ecole de Technologie Superieure, Montreal, Canada.

Wednesday, November 18, 2020 - 10:30 AM (ET)

New Advances in 3D Sensing

Learn what advances in sensor quality and speed, embedded systems, FPGAs, lasers, optics, and smart systems are driving into 3D scanning and measurement. Gain insight into solving practical applications with Hydra, our new ToF CMOS image sensor, delivering reliable 3D detection of fast-moving scenes to enable real-time decision-making. See how Teledyne is combining image sensor speed, accurate algorithms, and easy-to-use software to solve challenging in-line 3D inspection, detection and measurement applications on the factory floor using our next generation Z-Trak 3D profile sensors.


Meet Inder
Inder Kohli - Senior Product Manager, Teledyne DALSA

Inder Kohli is a Senior Product Manager at Teledyne DALSA. Inder has been instrumental in bringing several of Teledyne DALSA’s leading image acquisition and processing hardware and software products to market over his 26 years at the company. For the last three years his focus has been to create a new portfolio 3D imaging products. Inder holds a Bachelor’s Degree in Commerce, a Diploma in Electrical Engineering and, a Certificate in Management Information Systems from McGill University, Canada.

Meet Ha Lan

Ha Lan Do Thu - Marketing Manager, Teledyne e2v

Ha Lan Do Thu is Marketing Manager for 3D products and applications at Teledyne e2v. Her areas of expertise include strategic and product marketing, innovative imaging products and technologies with an emphasis on understanding market needs, product definition and rollout. She graduated in Electronic Engineering from the Grenoble Institute of Technology, France and from the Grenoble Business School, France with a Masters in Technology and Innovation Management.

Sergio Morillas - Business Manager, Teledyne e2v

Sergio Morillas is Business Manager for 3D products and applications in Teledyne e2v. He is in charge of marketing and project management for new product development. He has more than 15 years of experience in CMOS sensors and imaging systems, particularly embedding technologies used for 3D measurement.

Thursday, November 19, 2020 - 9:00 AM (ET)

Beyond Sight! Non-Visible and Multi-Spectral Imaging

This session will highlight advancements in extra-visible imaging (X-ray, ultraviolet, shortwave IR, and longwave IR plus combinations). Learn how SWIR and LWIR imaging can reveal the non-visible, performing critical inspections in food sorting and temperature detection. Subject matter experts will speak on the combination that visible and IR bring. Plus, you’ll learn about the latest in multispectral filter technologies, including advancements in polarization, hyperspectral and multi-band imaging.


Meet Mike
Mike Grodzki -  Product Manager, Teledyne DALSA

Mike began his career at Teledyne DALSA as a Research Analyst, and since 2018, has served as Product Manager for the company’s Linea SWIR series, and the soon-to-be-released Linea2 line scan cameras. Mike is a passionate product professional and thrives on building relationships with customers to understand their pain points and drive a product strategy that resonates with the market.

Meet Jean
Jean Brunelle - Product Manager, Teledyne DALSA

Jean Brunelle is Product Manager for a line of uncooled thermal imaging sensors, cores and cameras at Teledyne DALSA. His expertise extends from optoelectronics to material science to semiconductor physics, which he combines with a decade’s experience in sensor development, testing, and integration. Jean holds a bachelor’s degree in Engineering Physics and a master’s degree in Surface Science.

Thursday, November 19, 2020 - 10:30 AM (ET)

Evolving CMOS Sensor Technology

This technology session will examine state-of-the art CMOS sensor technology and how these innovations are impacting imaging. Review the latest pixel and ADC structures, 3D-stacking, chip-stacking, nano-imprinting and onboard processing, as well as new techniques in packaging and interfaces, and discover how these increase performance while reducing size and power, unlocking new and exciting applications for imaging. See the benefits of these innovations in the field using our newest Snappy and Emerald series sensors as well as our latest MIPI optical module.


Florian Julien - Business Manager, Teledyne e2v

Florian Julien is Business Manager in the Machine Vision team of Teledyne e2v’s Professional Imaging group. With 20 years of experience in electronic design he combines deep technical expertise with a wide product management portfolio across Space, Medical, and Industrial applications. Florian holds a Master of Engineering degree in Electronics from Polytech Lille, Ecole d'ingénieurs and a Master of Science in Electronics from the University of Lille.

Meet Marie-Charlotte
Marie-Charlotte Leclerc - Product Manager, Teledyne e2v

Marie-Charlotte Leclerc is Product Manager in charge of CMOS sensors at Teledyne e2v in Grenoble, France. She has an engineering degree in semiconductors and two master's degrees--in business management and administration, and in optics and semiconductors.


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