Process Services

Teledyne Imaging has a broad and extended range of semiconductor processing capabilities and established processes.

Teledyne Imaging has a broad and extensive range of semiconductor processing capabilities and established processes covering column II-VI, III-V and IV semiconductor materials such as Silicon, Cadmium, Mercury, Tellurium, Gallium, Indium, Arsenic and Antimony.

With an established portfolio of processes across the project lifecycle which are certified to ISO90001:2015, ISO140001:2004 ISO180001:2004, ESCC and ESD control (BS EN 61340-5-1 / 5-2).

We can offer:

  • II-VI and III-V growth
  • Silicon processing
  • Hybridisation
  • Backthinning and coatings for 3rd party image sensors - increased performance
  • Component, sub-system and system packaging
  • Package cleaning services, handling and cleaning training
  • Upscreening to COTS+
    • For extremes of shock, vibration, temperature and radiation tolerance

UK Facility Process Services

Click below for more detail the services we offer in our UK facilities.

  • Qty 2 Photolithography stepper
  • Mask aligners
  • Plasma Asher System
  • Spin coater
  • Sputter coater

  • Thermal oxidation furnace
  • Sputter coating / metallisation coater
  • PECVD Plasma-enhanced chemical vapour deposition
  • Anti-reflective coater
  • Backthinning coating chamber
  • Ion implanter

  • Wet etching
  • Dry etching

  • Qty 10 environmental chambers
  • Vibration test system
  • Mechanical shock system
  • Bounce machin

  • Temperature controlled Coordinate Measuring Machines (CMM) (non-contact)
  • A suite of classic optical microscope to cover needs in wafer/material inspection and imaging
  • Ultaraviolet
  • Scanning Electron Microscopes
  • SEM Sample Preparation coating System
  • Thin-film Measurement
  • Opto-digital microscopes

  • Chemical/wet wafer clean
  • Chemical polishing wafer unit
  • Wafer dicing / wafer saw

  • 6” and 8” silicon wafer backthinning processes
  • Bake ovens
  • Precision component cleaning (chemical and physical)
  • Polishing tables
  • Hardness measurement
  • Environmental cycling chambers
  • Precision custom assembly processes
  • Handling and process jig design and manufacture
  • Chip wire-bonding machine
  • Chip wire pull testing machine
  • Laser anneal machine
  • Camera test systems

Learn more

Questions? Need more info? Contact our sales team today.

Contact us