Teledyne has a long history in enabling Earth Observation (EO) missions for ESA, NASA, JAXA and other space agencies to acquire observations of the Earth’s surface and atmosphere via remote sensing instruments. With aerospace technologies continually, evolving, remote sensing and digital data collection applications are increasing in Low Earth Orbit (LEO) and increasingly to airborne platforms. With an eye to the rapidly evolving market in High Altitude Pseudo Satellites (HAPS) Teledyne Imaging is developing its next generation product platforms with this in-mind.
Teledyne imaging’s sensor portfolio for Earth observation and remote sensing passive imagery covers the complete range of imaging techniques in the visible spectrum including panchromatic, multi-spectral, pan-sharpened and hyper-spectral. Specialist X-ray, ultraviolet (UV) and infrared solutions are also available.
With a complete portfolio in CCD devices and an ever-expanding range of front and backside illuminated radiation hardened CMOS detectors, you can be sure we can supply you with the solution for your mission that meets the spectral, data, functionality, cost and power requirements of the remote sensing instrument.
Teledyne has a long history in enabling Earth Observation (EO) missions for ESA, NASA, JAXA and other space agencies, with the criticality of understanding the Earth system and its processes in the context of global change Teledyne has worked with ESA’s and NASA’s living planet programmes since the 1980’s which has directed technological image sensor development to meet these goals specifically.
Teledyne imaging’s sensor portfolio for living planet passive imagery covers the complete range of imaging techniques in the visible spectrum including panchromatic, multi-spectral, pan-sharpened and hyper-spectral. Specialist X-ray, ultraviolet (UV) and infrared solutions are also available.
With a complete portfolio in CCD devices and an ever-expanding range of front and backside illuminated radiation hardened CMOS detectors, you can be sure we can supply you with the solution for your mission that meets the spectral, data, functionality, cost and power requirements of the remote sensing instrument.
With more than 80 flown missions and programmes that the Teledyne Imaging group have provided the remote sensing detector for and more than 20 planned missions, Teledyne has a proven and enviable market leading position in space qualified imaging solutions.
Examples:
Resolution: 1022 × 2050 Pixel size: 26 µm High readout rates and high signal capacity
Resolution: 1024 × 1024 Pixel size: 13 µm Back illumination technology and extremely low noise amplifiers
Resolution: 720 × 1152 Pixel size: 22.5 µm Full-frame imaging device with two image area sections that can be clocked separately
Resolution: 1252 × 1152 Pixel size: 22.5 µm Full-frame imaging device with two image area sections that can be clocked separately
Resolution: 16 × 16 Pixel size: 16 µm
Resolution: 1024 × 1024 Pixel size: 13 µm Extreme performance in high frame rate ultra-low light applications
Resolution: 1024 × 1024 Pixel size: 10 µm Extreme performance in high frame rate ultra-low light applications
Resolution: 78 × 0 Pixel size: 13 µm
Resolution: 450 × 1060 Pixel size: 28 × 42 µm
Resolution: 24100 × 128 Pixel size: 7 µm Multispectral, multi-die TDI image sensor array
Resolution: 36200 × 128 Pixel size: 7 µm Backside thinned, multispectral, multi-die TDI image sensor array
Resolution: 1024 × 1024 Pixel size: 8.5 µm Frame transfer CCD array image sensor with 8.5 μm pixel, MPP mode and 100x antiblooming
Resolution: 8192 × 80 Pixel size: 7 µm TDI CCD image sensor with 7 μm x 7 μm pixels, selectable outputs and 100x antiblooming.
Resolution: 12288 × 128 Pixel size: 7 µm 12k pixel backside illuminated, bidirectional, multispectral TDI CCD
Resolution: 12288 × 64 Pixel size: 7 µm dual zone, unidirectional TDI CCD with continuous vertical clocking and 16 or 8 selectable outputs per zone
Resolution: 2208 × 320 Pixel size: 30 µm Split frame transfer backside thinned area array CCD image sensor with 30 μm x 30 μm pixels, selectable outputs and exposure control
Resolution: 2048 × 2048 Pixel size: 10 µm Highly flexible CMOS image sensor platform designed for a large range of space applications.
Resolution: 16000 × 4 Pixel size: 5 µm Very high resolution CMOS time delay integration (TDI) image sensors with CCD on CMOS architecture designed for space satellite Earth observation (EO) applications.
Resolution: 1280 × 1024 Pixel size: 5.3 µm 1.3 Mpixels B&W and Color CMOS Image Sensor
Resolution: 1280 × 1024 Pixel size: 5.3 µm 1.3 Mpixels B&W and Color CMOS Image Sensor
Resolution: 244 × 488 Pixel size: 70 µm space qualified CMOS image sensors, with unparalleled performance in terms of sensitivity, radiation tolerance and low power consumption.
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| Copernicus Program Brochure |
